| Item |
| Criteria |
Specification |
|
1 |
| Material |
Hg 1-x Cd x Te
Projected annual requirement (this specification PLUS other specifications under consideration) |
|
|
|
|
Projected number of wafers required
Projected number of planks required |
|
| 2 |
| Type |
N-Type
P-Type
Type
|
|
3
4
| Either... | Cut off wave-length
At
| µm +/- µm
@77k
@300k
|
|
5
| or...
| x-factor range
| X= +/- |
|
6
|
|
77K Electron
Carrier Concentration | 4x1014 cm-3(1.01 E14
to 7.05E15)
Our spec ok
or your spec
|
|
7
|
| 77K Electron
Mobility | 1.5x105 cm2.V-1.sec-1
(5.86 E4 to 1.69E5)
Our spec ok
or your spec
|
|
8
|
| Wafer Diameter |
15mm (standard)
quantity required
(if planks may be acceptable instead please tick here)
|
|
9
|
|
Wafer planks | Length - 20mm:Width up to 15mm (standard)
quantity
required
(if wafers may be acceptable instead please tick here)
|
|
10
|
| Wafer/plank Thickness
(Please select)
| 0.5mm (standard)
1mm
2mm
Or your spec
|
|
11
|
| Surface Finish | Mechanical-chemical mirror polish (MCP) on both sides
Any special requirement, please specify
|
|
12
|
| Documentation | Carrier concentration and mobility @77K and @300K -
qualified in Hall and FTIR measurements
Our docs ok
Any special requirement, please specify
|
|
13
|
| Sampling | Any special requirement, please specify |
|
|
|
| |
|
| 14 |
|
Your special requirement |
Contact us about anything you do or don’t see here… we will aim to meet your specific needs. For example:
1. Slitting wafers (eg: into narrow planks) as required
2.
Slivering wafers into thinner wafers to create two mirror image wafers 125micron thick
3.
Custom doping or annealing
4.
Post-passivation thinning
5.
Bonding to substrates
6.
Custom testing, even on customer-supplied samples (for correlation purposes) |
|
